This patented electronic instrument allows real-time, in-tank, stress monitoring of the plating process. True condition stress effects are obtained directly from the process. No masking steps are needed. The instrument has undergone extensive testing for both repeatability and durability.

The unit is typically used in-tank with the process anodes in place while the parts are plating. This greatly simplifies stress monitoring of the actual plating process effects. This includes effects due to agitation, power supply ripple, additives, pH and other chemistry changes. Pulsed plating stress analysis can be performed in real-time. The signal may be recorded to provide permanent QC records or graphs.

Options include precious metal membrane, self contained plating power supply, and direct computer interface through USB buss. The noble membrane permits stripping of nickel right in the tank without harsh chemicals. Complete PC systems are available for zero stress plating and electroforming in real-time.

Present users include many of the major aerospace corporations, national laboratories, optical fabrication companies, and developers and suppliers of plating processes. These include American, Asian and European corporations.

This item represents a change in the manner by which stress typically has been monitored in plating. The significance of the new instrument is that an electrical signal is provided as the output and may be utilized in many different ways. Note that the instrument has NO linkage, foil strain gauges, non-constrained components or masking requirements. Many tests can be performed prior to stripping the gauge. Data such as stress versus current density or additive concentrations may be obtained in minutes.